Electrical connection device for high density contacts

Details Electrical connection device for high density contacts Electrical connection device for high density contacts

1981-12-02

1984-05-01

Abrams, Neil

Geometrical instruments

339 61M, H01R 2372

Patent

active

044457359

ABSTRACT:
The invention provides an electrical connection device for connecting high density contacts of large scale integrated circuits (LSI) and serves to establish electrical connection between the contact areas (15) of the circuit network (14) on a substrate (11) for supporting integrated circuit devices (12) and the contact pads (18) of a conductor network (17) on a printed circuit card (13). The electric connection device comprises a plurality of conductive elements disposed within a housing (26) extending in a given direction. The conductive elements are electrically insulated one from the other and have contacts which are exposed through slots in the housing to connect to the areas (15) and pads (18). The conductive elements (29) are stacked in the given direction and are formed each with a conductor sheet (30) provided with two contact surfaces (31a, 32a) elastically movable in a plane normal to the given direction independently of the surfaces of contact of neighboring sheets. The conductor sheet are supported on elastically deformable rolls extending the length of the support means which enable the contact surfaces to be displaced and compensate for deformities in the substrate and manufacturing tolerances.

REFERENCES:
patent: 3215968 (1965-11-01), Herrmann
patent: 4008300 (1977-02-01), Ponn
patent: 4008519 (1977-02-01), Gillissen et al.
patent: 4161346 (1979-07-01), Cherian et al.
patent: 4176895 (1977-12-01), Aldridge
patent: 4199209 (1980-04-01), Cherian et al.
patent: 4202588 (1980-05-01), Dalamangas et al.
patent: 4209799 (1980-06-01), Schierz et al.
patent: 4278990 (1981-07-01), Fichot
patent: 4344662 (1982-08-01), Dalamangas et al.
IBM Technical Disclosure, Durand, vol. 21, No. 3, pp. 1064-1065, 8-1978.

Affiliated with

Also associated with

Rating

Electrical connection device for high density contacts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical connection device for high density contacts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical connection device for high density contacts will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2028016