Electrical connection device for forming metal bump electrical c

Details Electrical connection device for forming metal bump electrical c Electrical connection device for forming metal bump electrical c

1996-10-23

1999-11-09

Warden, Jill

Coating apparatus

Projection or spray type

Applying solid particulate material

2282481, B05B 700

Patent

active

059806362

ABSTRACT:
An electrical connection device for spraying fine metal particles to form a bump electrical contact. The device includes an element for creating fine metal particles, a unit for conveying the fine metal particles and a carrier gas, and a spraying unit connected to the conveying unit. The spraying unit disperses the particles onto a surface to form the bump contact.

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Iwama et al, Sintering of Ultrafine Metal Powders. I. Coalescence Growth Stage of Au and Ag, Japanese Journal of Applied Physics, vol. 19, No. 6, pp. 1039-1044, Jun. 1980.

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