Electrical connectors – Including elastomeric or nonmetallic conductive portion – Adapted to be sandwiched between preformed panel circuit...
Reexamination Certificate
2000-01-11
2001-12-25
Sircus, Brian (Department: 2839)
Electrical connectors
Including elastomeric or nonmetallic conductive portion
Adapted to be sandwiched between preformed panel circuit...
C439S066000, C439S591000
Reexamination Certificate
active
06332786
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
This invention relates to an electrical connection device employing an anisotropic electrically conductive film.
2. Description of the Related Art
In keeping up with the reduction in size and thickness of electronic components, the circuitry used in the electronic components is increasing in density and in precision in design rule. Since the connection between the electronic components and the fine-sized electrodes cannot be coped with by the conventional solder or a rubber connector, an adhesive or a filmed article, exhibiting anisotropy and electrical conductivity, referred to below as a connecting member, is preferentially used in order to cope with the tendency towards fine pitch.
This connecting member is comprised of an adhesive, containing a pre-set amount of the electrically conductive material, such as electrically conductive particles. This connecting member is provided between protuberant electrodes of the electronic components and an electrically conductive pattern of a printed circuit board and is pressured with or without heating to interconnect the electrodes of the electronic components and the printed circuit board. Moreover, the neighboring electrodes are insulated from each other and the protuberant electrodes are bonded and secured to the electrically conductive patterns of the printed circuit board.
The anisotropic electrically conductive film is mainly used as an adhesive film for the peripheral portions of a liquid crystal panel. Recently, the anisotropic electrically conductive film has come to be used in the field of semiconductor mounting in which a LSI (large-sized integrated circuit) chip is directly mounted on a resin substrate such as a mother board.
With the anisotropic electrically conductive film, electrically conductive particles are captured between electrodes desired to be connected to each other for establishing electrical connection therebetween. In the electrical connecting portion in the vicinity of the conventional liquid crystal panel, a large number of electrically conductive particles contributing to electrical connection can be provided, because of the large electrode area, so that the connection resistance hardly presented problems.
Meanwhile, in flip-chip mounting, which has recently attracted attention, endeavours have been made to reduce the pitch and the area of the electrodes, due to reduction in size of the components. In the connection employing the anisotropic electrically conductive film, the number of captured particles is reduced with the reduction in size of the electrodes, thus raising the resistance value per electrode.
Heretofore, tens to hundreds of particles can be provided between the electrodes. In recent mounting configurations, the number of the particles is reduced to only a few.
That is, in recent mounting configurations, the number of the particles of the anisotropic electrically conductive film taking part in the electrical connection is only a few, it is necessary to reduce the connection resistance value by these few particles to raise the electrical connection efficiency.
SUMMARY OF THE INVENTION
It is therefore an object of the present invention to provide an electrical connection device employing an anisotropic electrically conductive film, in which the value of the connection resistance by the small number of particles can be decreased to assure positive electrical connection.
In one aspect, the present invention provides an anisotropic electrically conductive film in which metal coated particles having a resin as a core material are dispersed in an insulating adhesive, wherein the resin of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 angstroms (Å).
In the anisotropic electrically conductive film, the metal layer has a gold (Au) plating film with a thickness of 400 to 1000 Å. The metal layer is made up of the Au plating film and a nickel (Ni) layer.
In another aspect, the present invention provides an electrical connection device which, for electrically connecting first and second objects, employs an anisotropic electrically conductive film in which metal coated particles having a resin as a core material are dispersed in an insulating adhesive, wherein the resin of the metal coated particles is coated with a metal layer having a thickness of 1000 to 3000 Å.
In the electrical connection device, the metal layer has an Au plating film with a thickness of 400 to 1000 Å. The metal layer is made up of the Au plating film and a Ni layer.
Also, in the electrical connecting device, the first object is a printed circuit board, the second object is an integrated circuit and the printed circuit board and the integrated circuit are electrically connected to each other via the anisotropic electrically conductive film.
REFERENCES:
patent: 4902857 (1990-02-01), Cranston et al.
patent: 5001302 (1991-03-01), Atsumi
patent: 5586892 (1996-12-01), Sato
patent: 5604379 (1997-02-01), Mori
patent: 5624268 (1997-04-01), Maeda et al.
patent: 5681402 (1997-10-01), Ichinose et al.
patent: 5813870 (1998-09-01), Gaynes et al.
patent: 6008451 (1999-12-01), Ichinose et al.
Honda Noriyuki
Suga Yasuhiro
Hyeon Hae Moon
Kananen Ronald P.
Rader & Fishman & Grauer, PLLC
Sircus Brian
Sony Corporation
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