Electrical connection between buses on a semiconductor integrate

Details Electrical connection between buses on a semiconductor integrate Electrical connection between buses on a semiconductor integrate

1991-05-28

1993-02-09

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257774, 257775, H01L 2160, H01L 2348

Patent

active

051856522

ABSTRACT:
An electrical connection between a first bus and a second bus on a semiconductor integrated circuit device manufactured using conventional CMOS technology. The first bus has a horn shape which permits a plurality of vias to be arranged in an arc thereon. This arrangement of vias facilitates permitting the current to flow substantially evenly between a first bus and a second bus.

REFERENCES:
patent: 3795845 (1974-03-01), Cass et al.
patent: 4021838 (1977-05-01), Warwick
patent: 4587549 (1986-05-01), Ushiku
patent: 4975758 (1990-12-01), Crafts
Braen, "Power Distribution for Large-Scale IC Devices", IBM TDB, vol. 16, No. 7, Dec. 1973, pp. 2308-2309.
Dahmen, "Measuring the Contact Resistance of Metallization on Silicon", IBM TDB, vol. 14, No. 3, Aug. 1971 p. 969.

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