Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2009-02-24
2011-12-20
Arbes, Carl (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S840000, C029S844000, C228S180220
Reexamination Certificate
active
08079141
ABSTRACT:
The method for providing the solder connection of the present invention is a method for providing a solder connection, which electrically connects a first electronic component having a solder bump to a second electronic component having a protruded electrode to provide electrical connection between the first solder bump and the protruded electrode, wherein a relation of: A+B>C is satisfied, where a height of the first solder bump from one surface of the first electronic component is presented as A [μm], a height of the protruded electrode before the compressive deformation from one surface of the second electronic component is presented as B [μm], and a thickness of the adhesive agent layer is presented as C [μm], and further comprising: disposing the adhesive agent layer in the first electronic component; and deforming the first solder bump and the protruded electrode and providing a contact of the above-described protruded electrode with the above-described first solder bump, so that the sum of the height A [μm] of the first the solder bump and the height B [μm] of the above-described protruded electrode is substantially equivalent to the thickness C [μm] of the above-described adhesive agent layer.
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Arbes Carl
Ditthavong Mori & Steiner, P.C.
Sumitomo Bakelite Co. Ltd.
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