Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2006-03-21
2006-03-21
Nguyen, Khiem (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
Reexamination Certificate
active
07014474
ABSTRACT:
An electrical connection and a method of electrically coupling are disclosed. In one embodiment, a circuit substrate with a first set of circuitry has a bonding pad mounted to a surface of the circuit board. The bonding pad is electrically coupled to the first set of circuitry. A flexible circuit substrate with a second set of circuitry has a connecting pad mounted to a surface of the flexible circuit substrate facing the surface of the circuit board. The connecting pad is electrically coupled to the second set of circuitry. A ball of conductive material is mounted on the bonding pad. A clamping device presses the connecting pad to the ball of conductive material.
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patent: 5742484 (1998-04-01), Gillette et al.
patent: 5744759 (1998-04-01), Ameen et al.
patent: 5938453 (1999-08-01), Ichimura
patent: 6002589 (1999-12-01), Perino et al.
Wu Li Xing
Zhang Liu Jun
Nguyen Khiem
SAE Magnetics (H.K. ) Ltd.
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