Electrical connecting structure for electrically connecting term

Details Electrical connecting structure for electrically connecting term Electrical connecting structure for electrically connecting term

1995-03-24

1997-10-21

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, H05K 102

Patent

active

056799284

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION

1. Field of the Invention
The present invention relates to an electrically connecting structure and a method of electric connection. More specifically, the invention relates to an electrical connection using an electrically conducting adhesive.
2. Description of the Related Art
Referring, for example, to Japanese Unexamined Patent Publication (Kokai) No. 52-70369, a connection terminal portion of a substrate provided on a glass substrate which is a liquid crystal panel and a terminal portion of an external circuit substrate are electrically connected together by disposing an electrically conducting rubber between the connection terminal portion of the substrate and the terminal portion of the substrate for connection to an external circuit, involves problems in regard to the assembling operation efficiency since the electrically conducting rubber must be incorporated at a specified position and lack of stability in the contact between the electrically conducting material in the electrically conducting rubber and the terminal portions.
In order to solve the above-mentioned problems, therefore, there has been proposed technology which uses an anisotropic electrically conducting adhesive containing electrically conducting particles instead of using an electrically conducting rubber.
As for means of using an isotropic electrically conducting adhesive disclosed in the aforementioned Japanese Unexamined Patent Publication (Kokai) No. 52-70369, furthermore, Japanese Unexamined Patent Publication (Kokai) No. 58-115779 discloses, by way of numerical figures, a concrete example of electrically connecting a connection terminal portion of a substrate and a terminal portion of an external circuit substrate by using an anisotropic electrically conducting film.
In order to impart electric conduction to parts having low heat resistance such as liquid crystal panels and the like, an anisotropic electrically conducting adhesive has been much used in recent years as taught by the aforementioned prior art. Referring, for instance, to FIGS. 7 and 8 which are diagrams explaining the prior art, electrodes 33 and electrodes 41 are formed on the facing surfaces of a pair of substrates 30 and 40 that are disposed in facing manner, a connection terminal portion 31 of the electrodes 33 and a connection terminal portion (not shown) of the electrodes 41 are disposed on the outside of a sealing portion 50, and liquid crystals are sealed inside the sealing portion 50 to constitute a liquid crystal display device.
A prior art will now be explained with reference to FIGS. 8 and 9 which are views of a liquid crystal display device along the line A--A of FIG. 7. In FIGS. 8 and 9 which are sectional views along the line A--A of FIG. 7 of prior art, on the upper surface of the substrate 32 constituting the liquid crystal display device is disposed a connection terminal portion 31 that electrically couples the liquid crystal panel and the external circuit together, and the electrode composed of an indium tin oxide (ITO) film is disposed on the connection terminal portion 31 and on the pixel unit of the liquid crystal panel in which the liquid crystals are filled. Furthermore, a film-like electrically conducting sheet (hereinafter referred to as FPC) 10 is arranged facing the connection terminal portion 31 of the substrate 30.
Note that the FPC is usually formed in a film like configuration and thus it is generally used as an adhesive material, by being inserted into a space formed between two opposite electrodes. The FPC 10 is obtained by forming a copper pattern 13 which is an electrically conducting wiring pattern of copper or the like on a base film composed of a polyimide or the like, and applying a film of solder or tin of a thickness of 4 to 6 .mu.m onto the copper pattern 13 by electroplating. A portion constituted by the electrically conducting film 14 and the copper pattern 13 of FPC 10 facing the connection terminal portion 31 of the substrate 32 is referred to as connection terminal portion 11. The connec

REFERENCES:
patent: 4814040 (1989-03-01), Ozawa
patent: 5031308 (1991-07-01), Yamashita et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5155301 (1992-10-01), Mase
patent: 5225966 (1993-07-01), Basavanhally et al.
JP 5053219, Patent Abstracts of Japan, vol. 17, No. 360 (1993).

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