Electrical connecting method utilizing an anisotropic conductive

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29846, 29872, 174117FF, 1562739, H05K 334, H01R 4300

Patent

active

055028918

ABSTRACT:
A method of forming an electrical connection from a drive circuit to an electrical device is provided. An electrical connection structure includes: electrodes formed on a device side, electrodes formed on a flexible film carrier having an electrode pattern connected to a drive circuit; and an anisotropic conductive film having metal particles or metal plated particles dispersed therein, interposed between the electrodes on the device side and the electrodes on the flexible film carrier, for electrically connecting the electrodes facing each other through thermocompression bonding. The electrodes, on the flexible film carrier are exposed by removing the flexible film at an electrical connection area, and the length of each exposed electrode is from 1.5 mm to 2.5 mm.

REFERENCES:
patent: 4955132 (1990-09-01), Ozawa
patent: 5019201 (1991-05-01), Yabu et al.
patent: 5042919 (1991-08-01), Yabu et al.
patent: 5283947 (1994-02-01), Santo et al.
patent: 5299093 (1994-03-01), Takahashi

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