Electrical conductors formed from mixtures of metal powders and

Details Electrical conductors formed from mixtures of metal powders and Electrical conductors formed from mixtures of metal powders and

1995-07-12

1999-03-16

Beck, Shrive

Coating processes

Electrical product produced

Metal coating

427125, 427226, 427229, C25D 502

Patent

active

058827226

ABSTRACT:
The present invention relates to a thick film formed of a mixture of metal powders and metallo-organic decomposition (MOD) compounds in an organic liquid vehicle and a process for advantageously applying them to a substrate by silk screening or other printing technology. The mixtures preferably contain metal flake with a ratio of the maximum dimension to the minimum dimension of between 5 and 50. The vehicle may include a colloidal metal powder with a diameter of about 10 to about 40 nanometers. The concentration of the colloidal metal in the suspension can range from about 10 to about 50% by weight. The MOD compound begins to decompose at a temperature of approximately about 200.degree. C. to promote consolidation of the metal constituents and bonding to the substrate which is complete at temperatures less than 450.degree. C. in a time less than six minutes. The mixtures can be applied by silk screening, stencilling, gravure or lithography to a polymer-based circuit board substrate for producing rigid and flexible printed wiring boards in a single operation with negligible generation of hazardous wastes. The same mixtures can be used in place of solder to assemble circuits by bonding electrical components to conductors as well as to make the conductors themselves.

REFERENCES:
patent: 4130671 (1978-12-01), Naghesh et al.
patent: 4186244 (1980-01-01), Deffeyes et al.
patent: 4381945 (1983-05-01), Nair
patent: 4418099 (1983-11-01), Cuevas et al.
patent: 4463030 (1984-07-01), Deffeyes et al.
patent: 4487811 (1984-12-01), Eichelberger et al.
patent: 4548879 (1985-10-01), St. John et al.
patent: 4599277 (1986-07-01), Brownlow et al.
patent: 4650108 (1987-03-01), Gallagher
patent: 4775439 (1988-10-01), Seeger, Jr. et al.
patent: 4808274 (1989-02-01), Nguyen
patent: 4859241 (1989-08-01), Grundy
patent: 5059242 (1991-10-01), Firmstone et al.
patent: 5071826 (1991-12-01), Anderson et al.
patent: 5075262 (1991-12-01), Nguyen et al.
patent: 5173330 (1992-12-01), Asano et al.
patent: 5183784 (1993-02-01), Nguyen et al.
patent: 5250229 (1993-10-01), Hara et al.
patent: 5270368 (1993-12-01), Lent et al.
patent: 5338507 (1994-08-01), Anderson et al.
patent: 5378408 (1995-01-01), Carroll et al.
patent: 5395452 (1995-03-01), Kobayashi et al.
Materials, Silver Ink for Jet Printing, NASA Tech Briefs,Aug. 1989.
Liquid Ink Jet Printing with Mod Inks for Hybrid Microcircuits K.F. Teng, and Robert W. Vest, Dec. 1987 IEEE.
Ink Jet Printing of Hybrid Circuits, R.W. Vest, Tweedell and B.C. Buchanan, "Hybrid Microelectronics", vol. 6, pp. 261-267, 1983.
ITT Cuts Costs of PC Board Manufacturing, Kenneth Dreyfack, Electronics, vol. 52. No. 17, Aug. 16, 1979.
Vest et al., "Ink Jet Printing of Hybrid Circuits", pp. 261-267, Jan. 1989.

Affiliated with

Also associated with

Rating

Electrical conductors formed from mixtures of metal powders and does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical conductors formed from mixtures of metal powders and , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical conductors formed from mixtures of metal powders and will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-815200