Electrical conductor having unique solder dam configuration

Electricity: conductors and insulators – Conduits – cables or conductors – Single duct conduits

Patent

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Details

228118, 2281802, 361406, 361404, H05K 334

Patent

active

048598089

ABSTRACT:
An electrical interconnection lead pattern for connecting an integrated circuit to an electrical circuit comprises a plurality of electrical conductors and a plurality of non-continuous dielectric regions. Each conductor has a contact region wherein the conductor is subsequently electrically connected to a predetermined region on the integrated circuit. In addition, each of the contact regions are substantially parallel with respect to each and every other contact region. The dielectric regions comprise a material not amenable to soldering and are substantially parallel with respect to each and every other dielectric region so that the non-continuous regions between the dielectric regions are also substantially parallel. Lastly, the contact regions are substantially perpendicular with respect to each and every dielectric region, and disposed such that a portion of each of the contact regions contacts a portion of the non-continuous region between the dielectric regions and a portion of the dielectric region. This conductor pattern provides a high tolerance for misalignment between the contact regions, the dielectric regions, and the contacted regions of the integrated circuit without detrimental effects to the integrity of the resulting electrical connection.

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L. F. Miller, Controlled Collapse Reflow Chip Joining, IBM J. Res. Develop., May 1969, pp. 239-249.

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