Electrical conductor deposition method

Coating processes – Electrical product produced – Welding electrode

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427 96, 427 97, 427 98, 427123, 427125, 427140, B05D 306, B05D 512, B32B 3500

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active

050646850

ABSTRACT:
A conductive interconnection (27) on a substrate (11) is made by applying a metal-organic compound (25) to the substrate, exposing the metal-organic compound to laser beam radiation (14) in which the power level has been ramped to some specific level and, thereafter, moving the substrate with respect to the laser beam. The movement of the substrate is at an applied rate of speed such that the temperature within the metal-organic compound impinged by the laser beam is properly ramped with respect to time. This leaves a dependable metal deposition (27) which may be monitored through a viewing system (21).

REFERENCES:
patent: 4239789 (1980-12-01), Blum et al.
patent: 4340617 (1982-07-01), Deutsch et al.
patent: 4340654 (1982-07-01), Campi
patent: 4444801 (1984-04-01), Hongo et al.
patent: 4511597 (1985-04-01), Teng et al.
patent: 4526807 (1985-07-01), Auerbach
patent: 4636403 (1987-01-01), Fisanick et al.
patent: 4933204 (1990-06-01), Warren, Jr. et al.
patent: 4957775 (1990-09-01), Black et al.
patent: 4957880 (1990-09-01), Itoh et al.
patent: 4960613 (1990-10-01), Cole et al.
Ralph T. Hopper, "How to apply noble metals to ceramics," Ceramic Industry Magazine, 06/63, pp. 65-76.

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