Stock material or miscellaneous articles – All metal or with adjacent metals – Having metal particles
Patent
1983-01-28
1984-12-11
Padgett, Ben R.
Stock material or miscellaneous articles
All metal or with adjacent metals
Having metal particles
427 96, 427 98, B22F 704, H05K 312, H05K 318
Patent
active
044878117
ABSTRACT:
A low-cost conductor, e.g. a printed circuit, is prepared by applying a mixture of a metallic powder and polymer on a substrate and curing the polymer, followed by an augmentation replacement reaction being effected to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal on the surface exceeds that of the original metal powder at that surface. This procedure produces a contiguous layer of conducting metal on the substrate. The conductors thus formed can easily be soldered without leaching using conventional tin-lead solders.
REFERENCES:
patent: 3226256 (1965-12-01), Schneble, Jr. et al.
patent: 3576662 (1971-04-01), Diebold et al.
patent: 3764280 (1973-10-01), Lupinski
patent: 3801364 (1974-04-01), Kojima et al.
patent: 4284665 (1981-08-01), Heimala et al.
"Electroless Plating of Plastics", G. A. Krulik, pp. 361-365, vol. 55, No. 6, Journal of Chemical Education, Jun. 1978.
Eichelberger Charles W.
Wojnarowski Robert J.
Brookes Anne
Davis Jr. James C.
General Electric Company
Krauss Geoffrey H.
Padgett Ben R.
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