Electrical components for microelectronic devices

Details Electrical components for microelectronic devices Electrical components for microelectronic devices

2011-06-28

2011-06-28

Bryant, Kiesha R (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257SE27071, C257SE21009

Reexamination Certificate

active

07968969

ABSTRACT:
Electrical components for microelectronic devices and methods for forming electrical components. One particular embodiment of such a method comprises depositing an underlying layer onto a workpiece, and forming a conductive layer on the underlying layer. The method can continue by disposing a dielectric layer on the conductive layer. The underlying layer is a material that causes the dielectric layer to have a higher dielectric constant than without the underlying layer being present under the conductive layer. For example, the underlying layer can impart a structure or another property to the film stack that causes an otherwise amorphous dielectric layer to crystallize without having to undergo a separate high temperature annealing process after disposing the dielectric layer onto the conductive layer. Several examples of this method are expected to be very useful for forming dielectric layers with high dielectric constants because they avoid using a separate high temperature annealing process.

REFERENCES:
patent: 5668040 (1997-09-01), Byun et al.
patent: 6218258 (2001-04-01), Joo
patent: 6326316 (2001-12-01), Kiyotoshi et al.
patent: 7560392 (2009-07-01), Krishnan et al.
patent: 2001/0024849 (2001-09-01), Lin et al.
patent: 2001/0043453 (2001-11-01), Narwankar et al.
patent: 2002/0074582 (2002-06-01), Hiratani et al.
patent: 2003/0027393 (2003-02-01), Suguro
patent: 2003/0062558 (2003-04-01), Yang et al.
patent: 2003/0129306 (2003-07-01), Wade et al.
patent: 2003/0216017 (2003-11-01), Drab et al.
patent: 2006/0086952 (2006-04-01), Kim et al.
patent: 2007/0001241 (2007-01-01), Lim et al.
patent: 2007/0042540 (2007-02-01), Lee
Search Report and Written Opinion for International Application No. PCT/US2007/067942, Oct. 18, 2007, 10 pages.
Office Action issued Feb. 23, 2011 in Taiwan Application No. 096116503, 7 pages.
Examination Report issued Jan. 25, 2011 in European Application No. 07761689.4, 5 pages.

Affiliated with

Also associated with

Rating

Electrical components for microelectronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical components for microelectronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical components for microelectronic devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2738260