Electrical components and assemblies

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

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Details

174 524, 357 70, 361405, 361408, H05K 0332

Patent

active

048640794

ABSTRACT:
A surface-mounted electrical component has rectangular section leads that project outwardly from the edges of the component body. The leads are bent down towards the surface of the substrate and are twisted through 90 degrees about their length to make the leads compliant in a direction transverse of their width where they emerge from the body. The lower end of the leads are straight and untwisted, making a vertical butt solder joint with contact pads on the substrate. The twisted region of the leads are treated, such as by nickel plating, to render them non-wetted by solder. Because of the greater spacing possible between the contact pads, conductive tracks can extend through gaps between the contact pads beneath the body of the component.

REFERENCES:
patent: 3150288 (1964-09-01), Flanders et al.
patent: 3368114 (1968-02-01), Campbell et al.
patent: 3745513 (1973-07-01), Gross
patent: 4673967 (1987-06-01), Hingorany
patent: 4704320 (1987-11-01), Mizunoya et al.
patent: 4728751 (1988-03-01), Canestaro et al.
patent: 4739125 (1988-04-01), Watanabe et al.
patent: 4751199 (1988-06-01), Phy
patent: 4761518 (1988-08-01), Butt et al.
patent: 4764848 (1988-08-01), Simpson
Improved Lead Frame Structure for Surface Mounting Package, IBM Tech. Disc. Bull., vol. 29, #6, Nov. 1986, pp. 2562-2563.

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