Electrical component thermal management

Details Electrical component thermal management Electrical component thermal management

2011-08-30

2011-08-30

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S707000, C361S760000, C257S706000, C257S712000

Reexamination Certificate

active

08009429

ABSTRACT:
Thermal management features are described for use with electrical components. In some examples, an assembly includes a printed board that includes a thermally conductive thermal attach pad thermally connected to a heat sink, an electrically conductive attach pad that is separate from the thermally conductive attach pad, and an electrically conductive trace electrically connected to the electrically conductive attach pad. An electrical component can be electrically connected to the electrically conductive attach pad and the electrically conductive trace of the printed board. A thermal interface material is disposed adjacent at least a portion of a side surface of the electrical component and in contact with the thermally conductive attach pad. In this manner, the assembly may provide a thermally conductive pathway from an electrical component to the heat sink.

REFERENCES:
patent: 4396936 (1983-08-01), McIver et al.
patent: 5703753 (1997-12-01), Mok
patent: 5924191 (1999-07-01), Credle, Jr. et al.
patent: 5982031 (1999-11-01), Stockmeier
patent: 6181556 (2001-01-01), Allman
patent: 6278607 (2001-08-01), Moore et al.
patent: 6472741 (2002-10-01), Chen et al.
patent: 6477052 (2002-11-01), Barcley
patent: 6498394 (2002-12-01), Fehr
patent: 6608379 (2003-08-01), Yeo et al.
patent: 6681482 (2004-01-01), Lischner et al.
patent: 6735086 (2004-05-01), Weber et al.
patent: 6946190 (2005-09-01), Bunyan
patent: 6975025 (2005-12-01), LeBonheur et al.
patent: 7019976 (2006-03-01), Ahmad et al.
patent: 7375974 (2008-05-01), Kirigaya
patent: 7477527 (2009-01-01), Suhir
patent: 7579217 (2009-08-01), Zhao et al.
patent: 7592695 (2009-09-01), Reis et al.
patent: 7705447 (2010-04-01), Ganesan et al.
patent: 7759169 (2010-07-01), Filoteo et al.
patent: 2004/0099945 (2004-05-01), Ku
patent: 2009/0002950 (2009-01-01), Gertiser et al.
patent: 2009/0057871 (2009-03-01), Zhao et al.
patent: 2009/0109624 (2009-04-01), Chan et al.

Affiliated with

Also associated with

Rating

Electrical component thermal management does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrical component thermal management, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical component thermal management will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2689901