Fishing – trapping – and vermin destroying
Patent
1990-11-05
1992-06-09
Chaudhuri, Olik
Fishing, trapping, and vermin destroying
29841, 2281802, 174 522, 437211, H01L 2156
Patent
active
051206781
ABSTRACT:
An improved method is provided for assembling an integrated circuit component to a substrate by a solder bump interconnection that is reinforced by a polymer film. The component is attached to a region of the substrate by a plurality of solder bump interconnections that create a gap between the component interface and the substrate region. A polymer dam is applied to the region encircling the attached component spaced apart therefrom. A liquid polymer precursor material is applied to the region including the gap and is confined by the dam to prevent indiscriminate flow across the substrate. In one aspect of this invention, gas is vented from the gap through a passage in the substrate to enhance fill by the precursor liquid. In another aspect of this invention, the precursor liquid is injected into the gap through a passage in the substrate and spread outwardly therefrom. In any event, the precursor liquid infiltrates the gap about the solder interconnections and is cured to form a film that reinforces and protectively encapsulates the solder interconnections.
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patent: 4604644 (1986-08-01), Beckham et al.
patent: 4605153 (1986-08-01), Van Den Brekel et al.
patent: 4825284 (1989-04-01), Soga et al.
Nakano, F. et al., "Resin-Insertion Effect on Thermal Cycle Resistivity of Fkip-Chip Mounted LSI Devices", ISHM '87 Proceedings, pp. 536-541.
Cholewczynski Kenneth
Machuga Steven C.
Miller Dennis B.
Moore Kevin D.
Stafford John W.
Chaudhuri Olik
Fekete Douglas D.
Griffis Andrew
Motorola Inc.
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