Inductor devices – Core surrounding linear conductor
Patent
1988-06-13
1989-04-18
Kozma, Thomas J.
Inductor devices
Core surrounding linear conductor
333 12, 361302, H01F 1706
Patent
active
048231037
ABSTRACT:
To manufacture an electronic component of the present invention and according to a method of manufacturing the electronic component also of the invention, steps of positioning and temporarily fixing the electronic component element are performed by the use of a bent portion formed on the lead wire, the bent portion of the lead wire being pressed into the through hole of the electronic component element. Thereafter, the bonding agent, which was applied to the bent portion, is filled into the through hole of the electronic component element by capillarity. Alternatively, the bonding agent may be injected into the through hole after the lead wire is inserted. Thus, the bonding agent is filled in a shorter time.
REFERENCES:
patent: 3329911 (1967-07-01), Schlicke et al.
patent: 4146854 (1979-03-01), Ishino et al.
patent: 4247981 (1981-02-01), Watters
patent: 4378539 (1983-03-01), Swanson
Hamuro Mitsuro
Nakagawa Masayuki
Tabuchi Makoto
Kozma Thomas J.
Murata Manufacturing Co. Ltd.
LandOfFree
Electrical component having a lead wire secured in a through hol does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrical component having a lead wire secured in a through hol, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical component having a lead wire secured in a through hol will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2398878