Electrical component forming process

Details Electrical component forming process Electrical component forming process

1983-02-17

1985-02-19

Morgenstern, Norman

Stock material or miscellaneous articles

Composite

Of metal

148 631, 148 635, 148 63, 148 131, 148 132, 148 203, 428629, 428652, C23C 1100, C23C 1110

Patent

active

045006059

ABSTRACT:
The process of forming a composite with an alloy having an alloy component of about 0.5 to 12% aluminum and a matrix selected from a material of the group consisting of copper, iron or nickel. The alloy is heated in an oxygen-rich atmosphere to form a material oxide-rich layer on a surface of the alloy. The alloy is then heated in a reducing atmosphere to reduce the material oxide-rich layer to form an aluminum oxide on the surface of the alloy and a material-rich layer on the aluminum oxide layer.

REFERENCES:
patent: 1156170 (1915-10-01), Page
patent: 1851573 (1932-03-01), Elsey
patent: 3259526 (1966-07-01), Walker et al.
patent: 3341369 (1967-09-01), Caule et al.
patent: 3345218 (1967-10-01), Brookover et al.
patent: 3475227 (1969-10-01), Caule et al.
patent: 3546363 (1970-12-01), Pryor et al.
patent: 3618203 (1971-11-01), Pryor
patent: 3676292 (1972-07-01), Pryor et al.
patent: 3698964 (1972-10-01), Caule et al.
patent: 3726987 (1973-04-01), Pryor et al.
patent: 3730779 (1973-05-01), Caule et al.
patent: 3810754 (1974-05-01), Ford et al.
patent: 3826627 (1974-07-01), Pryor et al.
patent: 3826629 (1974-07-01), Pryor et al.
patent: 3837895 (1974-09-01), Pryor et al.
patent: 3852148 (1974-12-01), Pryor et al.
patent: 3906125 (1975-09-01), Uher
patent: 3925579 (1975-12-01), Finchum
patent: 4149910 (1979-04-01), Popplewell
patent: 4189331 (1980-02-01), Roy
patent: 4229234 (1980-10-01), Krutenat et al.
patent: 4361445 (1982-11-01), Pryor et al.
Lassen, "Use of Metal Core Substrates for Leadless Chip Carrier Interconnection", Electronic Packaging and Production, Mar. 1981, pp. 98-103.
Lyman, "Chip-Carriers, Pin-Grid Arrays Change the PC-Board Landscape", Electronics, Dec. 29, 1981, pp. 67-75.
Dance et al., "Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip Carriers", presented at the First Annual Conference of the International Electronics Packaging Society, Cleveland, Ohio, 1981.
Erickson, "Chip Carriers: Coming Force In Packaging", Electronic Packaging and Production, Mar. 1981, pp. 64-80.

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