Electrical component and production thereof

Details Electrical component and production thereof Electrical component and production thereof

2011-01-11

2011-01-11

Parker, Kenneth A (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S778000, C257S731000, C257S729000, C257S738000, C438S026000

Reexamination Certificate

active

07868448

ABSTRACT:
A modularly constructed electrical component having a module substrate, preferably, of Si, and having one or more preferably un-housed chips placed on the module substrate while being electrically connected thereto and each joined to the module substrate, e.g., by direct wafer bonding. A recess is provided in the module substrate so that a closed hollow space is formed when the chip is joined to the module substrate. The hollow space is not formed by a protective cap, which surrounds the chip and, with the module substrate, closes it on all sides. Rather it is formed by the joining of opposing contact areas of the chip underside and of the upper side of the module substrate. The component can be economically produced because it does not require a protective cap for creating the hollow space. The component has a higher yield than monolithic integration of the functional units.

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