Electrical component and method of mounting same

Details Electrical component and method of mounting same Electrical component and method of mounting same

1988-07-14

1989-10-10

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29837, 361400, 361403, 4283173, C09J 700

Patent

active

048729370

ABSTRACT:
A mounting entity comprises, in layered order, a pressure sensitive adhesive, a foam spacer, a second pressure sensitive adhesive, a filler, and a heat sensitive adhesive. The first pressure sensitive adhesive is attached to an electrical component which is then mounted upon a printed circuit with the heat sensitive adhesive in contact therewith. The passing of the board over a solder wave heats the top surface of the board to a temperature high enough to activate the heat sensitive adhesive and adhere the component to the board. The intermediate foam layer dampens shock and vibration.

REFERENCES:
patent: 3704515 (1972-12-01), Nelson

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