Electrical circuit element comprising thick film resistor bonded

Details Electrical circuit element comprising thick film resistor bonded Electrical circuit element comprising thick film resistor bonded

1975-10-28

1978-02-28

Lovering, Richard D.

Stock material or miscellaneous articles

Composite

Of quartz or glass

252514, 252518, 338308, 427101, 428434, 428901, B32B 1706

Patent

active

040768945

ABSTRACT:
Thick film resistive elements are prepared from an intimate admixture comprising silica, lead oxide and ruthenium dioxide or iridium dioxide which is heated to a temperature sufficient to provide a lead-containing glass having dispersed therein lead ruthenate or lead iridate. The lead-containing glass is comminuted and a resistor paste is formed which can be subsequently coated and fired on to a desired substrate to form the thick film resistive component. The method of this invention may facilitate the production of thick film resistors exhibiting a low temperature coefficient of resistivity, relative freedom from noise and drift, and high moisture resistance.

REFERENCES:
patent: 3293501 (1966-12-01), Martin
patent: 3304199 (1967-02-01), Faber, Sr. et al.
patent: 3324049 (1967-06-01), Holmes
patent: 3352797 (1967-11-01), Kim
patent: 3655440 (1972-04-01), Brady
patent: 3682840 (1972-08-01), Van Loan
patent: 3830651 (1974-08-01), Minneman et al.

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