Electrical circuit configuration arranged in a casing

Details Electrical circuit configuration arranged in a casing Electrical circuit configuration arranged in a casing

1998-07-10

2000-12-05

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361816, 361517, 361799, H05K 900

Patent

active

061575445

ABSTRACT:
To protect the high frequency circuits arranged in a casing and which are operated at frequencies of >1 GHz to 100 GHz against inner electromagnetic perturbing radiation, the complete circuit (1) is equipped on both sides with a large area layer (3, 4) which absorbs electrical fluctuations. The layer (4), made from a material which absorbs electrical fluctuations, such as silicon with average conductivity, is arranged below the circuit carrier (1). The circuit carrier (1) with the components (5) is encapsulated by a dielectric material such as silicon sealing compound or epoxy resin. The layer (3) made from a sealing compound which absorbs electrical fluctuations, such as silicon filled with iron powder, is arranged above the encapsulated circuit carrier (1, 2).

REFERENCES:
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patent: 5401688 (1995-03-01), Yamaji et al.
patent: 5438333 (1995-08-01), Perkins et al.
patent: 5500789 (1996-03-01), Miller et al.
patent: 5729441 (1998-03-01), Murakami
Patent Abstract of Japan, vol. 7, No. 154 (E-185) Jul. 6, 1983 & JP 58 063201 A (Matsushita Denki Sangyo KK) Apr. 15, 1983.
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Patent Abstract of Japan, vol. 7, No. 76 (E-167), Mar. 30, 1983 & JP 58 006142 A (Sanyo Denki KK), Jan. 13, 1983.
Patent Abstract of Japan, vol. 6, No. 247 (E-146) Dec. 7, 1982 & JP 57 147301 A (Mitsubishi Denki KK), Sep. 11, 1982.
Patent Abstract of Japan, vol. 13, No. 243 (E-768) Jun. 7, 1989 & JP 01 044097 A (Denki Kaguku Kogyo KK), Feb. 16, 1989.

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