Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-01-11
2005-01-11
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S707000, C361S760000, C361S761000, C257S706000, C257S717000
Reexamination Certificate
active
06842341
ABSTRACT:
An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one device aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the substrate device aperture overlaps the heat sink, the adhesive layer having at least one device aperture and at least one solder aperture, wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.
REFERENCES:
patent: 4030001 (1977-06-01), Medley et al.
patent: 5646444 (1997-07-01), Bartlett et al.
patent: 6011692 (2000-01-01), Bergstedt et al.
patent: 6108205 (2000-08-01), Bergstedt
patent: 6292374 (2001-09-01), Johnson et al.
patent: 6449158 (2002-09-01), Wang et al.
patent: 6537857 (2003-03-01), Aquien et al.
patent: 6580316 (2003-06-01), Olofsson et al.
patent: 6635958 (2003-10-01), Bates et al.
patent: 6787895 (2004-09-01), Jarcy et al.
Bielick Brian R.
Miller Herman J.
Van Cannon Billy J.
Waldvogel John M.
Chervinsky Boris
Davis Valerie M.
Motorola Inc.
LandOfFree
Electrical circuit apparatus and method for assembling same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrical circuit apparatus and method for assembling same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrical circuit apparatus and method for assembling same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3400865