Electrical circuit

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

Patent

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Details

427123, 427264, 427271, 4273722, 4273835, B05D 512

Patent

active

048288772

ABSTRACT:
An electrical circuit arrangement includes a conductive link through an insulating layer separating two conductive layers. This link is formed by placing an evaporable plug on a first conductive layer, forming the insulating layer around it and then vaporising the plug. The resulting gap is then infilled with conductive material and a second conductive layer formed on the insulating layer.

REFERENCES:
patent: 4343833 (1982-08-01), Sawae
patent: 4430365 (1984-02-01), Schaible
patent: 4624864 (1986-11-01), Hartmann
patent: 4629681 (1986-12-01), Takada

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