Electrical bias electrical test apparatus and method

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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C324S754090, C324S762010, C324S1540PB

Reexamination Certificate

active

10677155

ABSTRACT:
An apparatus and a method for electrically testing a microelectronic product employ an electrical probe tip for electrically stressing a portion of the microelectronic product other than an electrical contact portion of the microelectronic product when electrically testing the microelectronic product. The apparatus and the method provide for more accurate and efficient electrical testing of the microelectronic product.

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patent: 2002/0053917 (2002-05-01), Tanioka et al.
Bruce et al, “Soft Devect Localization (SDL) on ICs”, Proc. 28thInt. Symp. for Testing and Failure Analysis, Nov. 3-7, 2002, Phoenix, AZ, pp. 21-27.

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