Electrical assembly that includes a heat sink which is attached

Details Electrical assembly that includes a heat sink which is attached Electrical assembly that includes a heat sink which is attached

1998-07-06

2000-03-28

Thompson, Gregory

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 163, 257719, 361709, 361719, H05K 720

Patent

active

06043984&

ABSTRACT:
An electronic assembly which includes a heat sink that is pressed into an integrated circuit package by a clip. The integrated circuit package is mounted to a substrate. The clip has an L-shaped ear that is inserted through a clearance hole of the substrate and an attachment hole of the heat sink to attach the heat sink to the substrate. The clip also presses the heat sink into the package. Attaching the heat sink directly to the package reduces the flatness requirements of the sink and the cost of producing the assembly.

REFERENCES:
patent: 4441140 (1984-04-01), Richard
patent: 5109318 (1992-04-01), Funari et al.
patent: 5703752 (1997-12-01), Woo
patent: 5847928 (1998-12-01), Hinshaw et al.

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