Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2000-03-28
2001-05-29
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S709000, C361S715000, C361S719000, C174S016300, C165S185000, C257S719000, C257S727000, C248S510000
Reexamination Certificate
active
06239974
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electronic cartridge which has a heat sink.
2. Background Information
FIG. 1
shows a product marketed by Intel Corporation, the assignee of this application, which is referred to as a single edge contact cartridge (SECC). The Intel SECC includes a microprocessor which is assembled into a package
1
that is mounted to a substrate
2
. The SECC may also have other integrated circuit packages
3
which contain static random access memory (SRAM) integrated circuits.
One edge of the substrate
2
has a plurality of conductive pads
4
which can be inserted into an electrical connector
5
. The electrical connector
5
can be mounted to a printed circuit board
6
such as the motherboard of a computer. The pads
4
and connector
5
electrically couple the substrate
2
to the circuit board
6
.
The substrate
2
and integrated circuit packages
1
and
3
are enclosed by a cover
7
and a thermal plate
8
. The cover
7
, plate
8
and substrate
2
provide an electronic cartridge which can be plugged into a computer.
The electrical system shown in
FIG. 1
can be subjected to external shock and vibration loads. Such loads may produce intermittent separation between the pads
4
and the connector
5
. Intermittent separation between the pads
4
and connector
5
may create electrical “opens.” The system is provided with a retention mechanism
9
to secure the substrate
3
to the connector
5
and prevent contact separation under shock and vibration loads.
The retention mechanism
9
includes a pair of posts
10
that are mounted to the circuit board
6
. Each post
10
includes an aperture
11
which receives a latch
12
that extends from the cover
7
of the cartridge. When inserted into the aperture
11
each latch
12
prevents the substrate
2
from being pulled out of the connector
5
. The substrate
3
can be unplugged from the connector
5
by pressing a pair of latch levers
13
and pulling the cartridge away from the board
6
. Pressing the levers
13
moves the latches
12
out of the apertures
11
of the posts
10
.
The integrated circuits generate heat which must be removed from the circuits. The thermal plate
8
is thermally coupled to the integrated circuit package
1
of the SECC to provide a thermal path for the heat generated by the microprocessor. A heat sink
14
may be mounted to the thermal plate
8
to further facilitate the removal of heat.
The heat sink
14
typically contains a plurality of fins
15
which extend from a pedestal
16
. The pedestal
16
has a mounting surface
17
which mates with a corresponding surface of the thermal plate
8
. The mounting surfaces of the thermal plate
8
and the heat sink
14
must be relatively flat to insure that there are no air voids when the components are assembled. Air voids will significantly increase the thermal impedance between the thermal plate
8
and the heat sink
14
.
Stringent flatness requirements increase the cost of producing the heat sink and the overall assembly. It would be desirable to provide an electronic assembly similar to the SECC which has a lower cost heat sink.
SUMMARY OF THE INVENTION
One embodiment of the present invention is an electronic assembly which includes a heat sink that is pressed into an integrated circuit package by a clip. The integrated circuit package is mounted to a substrate. The clip has an L-shaped ear that is inserted through a clearance hole of the substrate and an attachment hole of the heat sink to attach the heat sink to the substrate.
REFERENCES:
patent: 4441140 (1984-04-01), Richard
patent: 5109318 (1992-04-01), Funari et al.
patent: 5168926 (1992-12-01), Watson et al.
patent: 5617294 (1997-04-01), Watson et al.
patent: 5642263 (1997-06-01), Lauruhn
patent: 5703752 (1997-12-01), Woo
patent: 5726865 (1998-03-01), Webb et al.
patent: 5748446 (1998-05-01), Feightner et al.
patent: 5779488 (1998-07-01), Cluff
patent: 5784263 (1998-07-01), Nelson
patent: 5829601 (1998-11-01), Yurchenco et al.
patent: 5838542 (1998-11-01), Nelson et al.
patent: 5841633 (1998-11-01), Huang
patent: 5847928 (1998-12-01), Hinshaw et al.
patent: 5854738 (1998-12-01), Bowler
patent: 5856910 (1999-01-01), Yurchenco et al.
patent: 5883782 (1999-03-01), Thurston et al.
patent: 5883783 (1999-03-01), Turturro
patent: 5884692 (1999-03-01), Lee et al.
patent: 5894408 (1999-04-01), Stark et al.
patent: 5903436 (1999-05-01), Brownell et al.
patent: 5920120 (1999-07-01), Webb et al.
patent: 5933323 (1999-08-01), Bhatia et al.
patent: 5933324 (1999-08-01), Barrett
patent: 5936838 (1999-08-01), Lii et al.
patent: 5943210 (1999-08-01), Lee et al.
patent: 5959350 (1999-09-01), Lee et al.
patent: 5969946 (1999-10-01), Lai et al.
patent: 5973399 (1999-10-01), Stark et al.
patent: 5978873 (1999-11-01), Phan
patent: 5982622 (1999-11-01), Chiou
patent: 5982630 (1999-11-01), Bhatia
patent: 5991152 (1999-11-01), Chiou
patent: 6002591 (1999-12-01), McCutchan et al.
patent: 6008988 (1999-12-01), Palmer
patent: 6008990 (1999-12-01), Liu
patent: 6011696 (2000-01-01), Mahajan et al.
patent: 6016006 (2000-01-01), Kolman et al.
patent: 6025990 (2000-02-01), Daskalakis et al.
patent: 6025994 (2000-02-01), Chiou
patent: 6043983 (2000-03-01), Taylor et al.
patent: 6046905 (2000-04-01), Nelson et al.
patent: 6056601 (2000-05-01), Pollock et al.
patent: 6068051 (2000-05-01), Wendt
patent: 6097601 (2000-08-01), Lee
patent: 6098938 (2000-08-01), Tsai
patent: 6111747 (2000-08-01), Jeffries et al.
Blakely , Sokoloff, Taylor & Zafman LLP
Chervinsky Boris L.
Intel Corporation
Picard Leo P.
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