Electrical assembly including a conductor pattern bonded to a no

Details Electrical assembly including a conductor pattern bonded to a no Electrical assembly including a conductor pattern bonded to a no

1982-06-11

1985-02-19

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228159, 228198, 29847, H05K 306

Patent

active

045000298

ABSTRACT:
An electrical assembly includes a conductor pattern, a non-metallic substrate, and a eutectic alloy situated between and bonding together the conductor pattern and the substrate. The conductor pattern includes an area with a surface facing the non-metallic substrate but spaced from the substrate. A method of fabricating such assembly includes, prior to bonding, the step of partially penetrating through the side of the metallic sheet to be bonded to the substrate in selected areas of the sheet. The remaining metal of the sheet in each selected area does not bond to the substrate during a eutectic bonding procedure. The non-bonded areas can implement a variety of structural features, including: (1) an electrical interconnect member which can operate at higher voltages due to a lengthened electrical creepage path on the surface of the non-metallic substrate: (2) a mechanical interconnect member for holding separate portions of a metallic sheet in alignment with each other prior to bonding to a substrate; and (3) a "via" or bridge-like member of one conductor pattern which crosses over another conductor pattern, both of which patterns are bonded to a non-metallic substrate.

REFERENCES:
patent: 2857663 (1958-10-01), Beggs
patent: 3766634 (1973-10-01), Babcock et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4413766 (1983-11-01), Webster

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