Electrical assembly for coupling two circuit members

Details Electrical assembly for coupling two circuit members Electrical assembly for coupling two circuit members

1999-11-02

2001-12-04

Luebke, Renee (Department: 2833)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C200S248000

Reexamination Certificate

active

06325638

ABSTRACT:

TECHNICAL FIELD
This invention relates to electrical assemblies for use in information handling systems (computers) and particular to such assemblies for electrically coupling two or more circuit members such as a printed circuit board or similar circuitized substrate and a semiconductor device (chip). Even more particularly, the invention relates to such assemblies wherein one or both of the circuit members includes solder elements as a connecting medium.
CROSS REFERENCE TO COPENDING APPLICATIONS
In Ser. No. 08/536,880, there is defined a socket for use with a ball grid array package structure to couple the package to a printed circuit board. An interposer is needed for positioning between the package and board to interconnect both using specially designed contact elements also referred to as dendrites. Ser. No. 08/536,880 is entitled “Socket for Semi-Permanently Connecting a Solder Ball Grid Array Device Using a Dendrite Interposer” and was filed Sep. 29, 1995. Ser. No. 8/536,880 is now U.S. Pat. No. 5,691,041 having issued Sep. 29, 1995.
In Ser. No. 08/352,301, entitled “Method and Apparatus For In-Situ Testing of Integrated Circuit Chips” (Ser. No. 08/352,301 is a continuation application of Ser. No. 08/024,549, both now abandoned). There is described a chip testing apparatus and method in which dendrites are used to couple solder elements of a chip and conductors of the test apparatus for testing(e.g., “burn-in”) of the chip. Ser. No. 08/352,301 was filed Dec. 4, 1994.
All of the above applications are assigned to the same assignee as the present invention and the disclosures of same are incorporated herein by reference.
BACKGROUND OF THE INVENTION
The use of circuit members, e.g., electronic modules, which include one or more semiconductor chips as part thereof for being electrically coupled to other circuit members referred to in the art as printed circuit boards or ceramic substrates is becoming more and more popular in the electronics packaging field. For increased wiring and input/output (I/O) densities, the use of such members wherein solder elements form the connecting medium is especially becoming more widespread. Various examples include what are referred to as ball grid array packages such as tape ball grid arrays (TBGAs), ceramic ball grid arrays (CBGAs) and plastic ball grid arrays (PBGAs), all of which include some form of substantially planar substrate on which one or more chips are coupled. These assemblies, also referred to in the art as first level packaging structures, are then coupled to another circuit member such as a printed circuit board to form what is defined in the art as a second level packaging structure. Such assemblies are then incorporated into larger processing structures for performing information handling functions.
The use of various connector apparatus for coupling different circuit members is known in the art, with examples shown and described in U.S. Letters Pat. No. 4,063,791 (Cutchaw), U.S. Letters Pat. No. 4,390,220 (Benasutti), U.S. Letters Pat. No. 4,420,203 (Awg et al), U.S. Letters Pat. No. 4,683,423 (Morton), U.S. Letters Pat. No. 4,874,318 (Spencer), U.S. Letters Pat. No. 4,923,404 (Redmond et al), U.S. Letters Pat. No. 4,933,808 (Horton et al), U.S. Letters Pat. No. 5,215,472 (DelPrete et al), U.S. Letters Pat. No. 5,397,245 (Roebuck et al) and U.S. Letters Pat. No. 5,468,157 (Roebuck et al). In U.S. Letters Pat. No. 4,063,791, e.g., chip-containing integrated circuit package is demountably positioned on a circuit board (called a backpanel in U.S. Letters Pat. No. 4,063,791) using a dielectric housing component which includes pins for coupling directly to the board's conductor elements. A cover is also utilized to cover the contained package. A somewhat similar structure is described in U.S. Letters Pat. No. 4,390,220 wherein a hold-down lid securedly retains an integrated circuit package in position relative to a housing also mountable on a printed circuit board.
Connector devices for directly coupling a semiconductor chip to a circuit member such as a printed circuit board or the like are shown and described in U.S. Pat. Nos. 4,874,318, 4,683,423 and 5,468,157. In U.S. Pat. No. 4,874,318, a chip is mounted onto a circuit board using a lock nut cemented to the chip carrier and extending through a socket moulding aperture. The use of such a lock nut obviously presents a somewhat awkward structure which in turn necessitates the use of the interim socket structure, thereby adding costs to the assembly. In U.S. Pat. No. 4,683,423, a chip is electrically coupled to spring biased contact members located within a housing, such that this subassembly can then be positioned on and coupled to another circuit member. A rotational clamp is used to compress the chip onto the contact members. The requirement for utilization of several springs, strategically oriented within a housing, adds to the cost and complexity of this assembly. In U.S. Pat. No. 5,468,157, an interconnection system is described in which a semiconductor chip is electrically coupled to a “thin film interconnect” within a modular structure which also uses a threaded screw for exerting pressure onto the chip. A series of annular springs and associated plurality of shims are used as part of this connection scheme, thus adding to the cost and complexity of this design.
In accordance with the teachings of the present invention, there is provided a new and unique electrical assembly (and an actuating mechanism for use as part thereof) in which two circuit members are electrically coupled together and in which a minimum of elements are used while assuring a relatively low profile (desired for microelectronic packaging structures, including some of those mentioned above), and, significantly, while accommodating for non-planarity of the surfaces of one or more of the structure's components (e.g., the circuit board and/or chip). This latter feature is considered particularly critical when coupling extremely small, highly dense components such a semiconductor chips and the circuit members associated therewith. The invention as defined herein also provides relatively easy and simple disconnection of the electrical circuit members should this feature be desired. As understood from the following, the invention is able to provide all of these and other advantageous features discernible from the teachings hereinbelow with a minimum of components which comprise a relatively simple and inexpensive structure.
It is believed that an electrical assembly possessing the above features would represent a significant advancement in the art.
SUMMARY OF THE INVENTION
It is, therefore, a primary object of this invention to enhance the electrical assembly art by providing an assembly and an actuating mechanism possessing the several advantageous features cited hereinabove and otherwise discernible from the teachings herein.
In accordance with one embodiment of the invention, there is provided an electrical assembly comprising first and second circuit members each having a plurality of electrical conductors, a substantially rigid member fixedly positioned with respect to one of the circuit members, a pressure plate independently movable with respect to the rigid member for forcibly engaging the other circuit member, and an actuator member which is movably positioned within the rigid member for engaging the pressure plate to cause it to engage said other circuit member such that the two circuit members' conductors are engaged (coupled).
In accordance with another embodiment of the invention there is provided an actuating mechanism for causing connection between two circuit members wherein the mechanism comprises a rigid member designed for being fixedly positioned with respect to one of the circuit members, a pressure plate designed for independent movement with respect to the rigid member and for forcibly engaging the other circuit member, and an actuator member designed for engaging the pressure plate to cause it to forcibly engage said other circuit member such that connecting of th

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