Electrical assembly

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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Details

174 16HS, 174 52FP, 361386, 361412, H05K 118

Patent

active

045637253

ABSTRACT:
An electrical assembly incorporates a multilayer printed circuit board comprising a flexible electrically insulating circuit board laminate with electrical conductors for connecting to terminals on rigid slab-like heat-dissipating components such as circuit or component packages or carriers. A separate rigid metallic heat-sinking or spreading plate is applied, having protruding thermally conducting pillars passing through holes in the circuit board laminate to contact the components. A further rigid plate overlies the components and is clamped by clips or bolts to the plate. Compliant means such as springs of deformable and elastic rubber or plastics material is provided intermediate the further plate and the top of the components to accommodate difference in height or thickness between the components while transmitting pressure from the further plate to the top of the component to ensure contact between the components and the pillars on the heat sinking or spreading plate.

REFERENCES:
patent: 3390308 (1968-06-01), Marley
patent: 3480836 (1969-11-01), Aronstein
patent: 3501832 (1970-03-01), Iwata et al.
patent: 3684818 (1972-08-01), Netherwood
patent: 4069497 (1978-01-01), Steidlitz
patent: 4408220 (1983-10-01), Calabro
patent: 4415025 (1983-11-01), Horvath
C. S. K. Ng, Circuit Module Package, IBM Tech. Discl. Bull., V. 21, #9, Feb. 1979, p. 3591.
Auletta et al., Module Package, IBM Tech. Discl. Bull., V. 18, #11, Apr. 1976, p. 3591.
R. C. Chu, Design for Providing Thermal Interface Material Between Narrow Thermal Interface Gaps, V. 20, #7, Dec. 1977, p. 2761.
Arnold et al., Module with Internal Elements for Reducing Thermal Resistance, IBM Tech. Discl. Bull., V. 21, #4, Sep. 1978, pp. 1473-1474.

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