Electrical assemblies

Details Electrical assemblies Electrical assemblies

1993-11-02

1995-01-03

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361768, 361777, 361821, 257779, 257786, 174261, 174262, 174263, H05K 702

Patent

active

053791894

ABSTRACT:
An electrical circuit has a substrate and a surface mount capacitor having a connector pad at each end. The substrate has two separate contact pads that are both soldered to the same connector pad on the capacitor. Two further contact pads on the substrate are soldered to the other connector pad on the capacitor. The contact pads on the substrate are connected to tracks that extend to plated-through holes and are electrically connected to one another at a point remote from the capacitor.

REFERENCES:
patent: 5083237 (1992-01-01), Tsuji
patent: 5132864 (1992-07-01), Takemura et al.
Patent Abstracts of Japan, vol. 17, No. 418 (E-1408), Aug. 4, 1993 "Electric Circuit for Leadless Component-Loading Substrate".
Patent Abstracts of Japan, vol. 14, No. 320 (E-0950), Jul. 10, 1990 "Mounting Structure of Chip Component".

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