Electrical assemblage and method for removing heat locally...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S704000, C361S720000, C361S767000, C174S252000, C257S706000

Reexamination Certificate

active

06882537

ABSTRACT:
A densely packed electronic assemblage has a substrate media for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the at least one heat generating component by absorbing heat from the at least one heat generating component.

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patent: 04113695 (1992-04-01), None
patent: 05082686 (1993-04-01), None

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