Electrical and thermal conducting structure with resilient condu

Details Electrical and thermal conducting structure with resilient condu Electrical and thermal conducting structure with resilient condu

1996-05-17

1999-04-06

Abrams, Neil

Electrical connectors

Including elastomeric or nonmetallic conductive portion

Adapted to be sandwiched between preformed panel circuit...

439 66, H01R 458

Patent

active

058909150

ABSTRACT:
A conducting structure includes a dielectric matrix with a first surface and a second surface. At least one via extends from the first surface of the matrix to the second surface of the matrix. In the at least one via conductive members are formed which include conductive elements and an optional binder. The conductive elements have a maximum dimension of: (i) at least about 5% of a length of the via, and, (ii) at least about 10% of the width of the via. The size, shape and number of conductive elements in each via, as well as the composition of the binder, may be selected to provide a conductive element with a controlled electrical and/or thermal conductivity, and a controlled modulus, for a particular application.

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