Electrical and/or thermal interconnections and methods for obtai

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

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Details

29846, 428901, H05K 100

Patent

active

051892618

ABSTRACT:
Circuit boards or cards containing metallic layers on opposite major surfaces of a dielectric substrate whereby electrical and/or thermal interconnection between the metallic layers is provided in vias that extend through one of the metallic layers, and the dielectric substrate and into the other metallic layer.

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