Electrical access for electrical lapping guides

Abrading – Precision device or process - or with condition responsive...

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Details

451 28, 2960309, B24B 4900, B24B 5100

Patent

active

054944732

ABSTRACT:
The invention provides a new method and apparatus for electrically accessing a lapping sensor positioned along a row of slider sites on a wafer. The apparatus for accessing the lapping sensor may be positioned outside of the boundaries of the slider sites. The apparatus may also provide top conductors electrically connecting target pads to contact pads. The process for lapping rows of slider sites includes coupling a measurement device to a target pad, coupling a lapping sensor to the top conductor, and lapping the row until the measurement device detects a predetermined signal from the lapping sensor.

REFERENCES:
patent: 3821815 (1974-06-01), Abbott et al.
patent: 4559743 (1985-12-01), Kracke et al.
patent: 4675986 (1987-06-01), Yen
patent: 4689877 (1987-09-01), Church
patent: 5023991 (1991-06-01), Smith
patent: 5095613 (1992-03-01), Hussinger et al.
patent: 5175938 (1993-01-01), Smith

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