Electric signal connecting device and probe assembly and...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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07368926

ABSTRACT:
The present invention is for enabling to carry out probing tests en bloc at the same time on electronic devices and semiconductor chips having high-density terminals. For this purpose, the electric signal connecting device includes vertical probes for getting into contact with terminals for electric connection created on electric functional elements to be tested for electric connection, and a resin film supporting the vertical probes, and the vertical probes are planted resiliently deformably in a surface of a resin film in a direction along the film surface, and an end of the vertical probes is brought into contact with terminals of electric functional elements to be tested and another end of the vertical probes is brought into contact with terminals of an electric function testing apparatus so that signals may be transmitted and received between the electric functional elements to be tested and the electric function testing apparatus.

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patent: 0802419 (1997-10-01), None
Faure, “Modular Probe”, IBM Technical Disclosure Bulletin, Nov. 1974, vol. 17, No. 6, p. 1634.
European Search Report issued Mar. 29, 2007 in Application No. EP 05 25 5613.

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