Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Controlling current distribution within bath
Patent
1997-11-13
2000-12-12
Valentine, Donald R.
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Controlling current distribution within bath
205137, 205151, 205291, 205148, C25D 500, C25D 704, C25D 338, C25D 520
Patent
active
061593540
ABSTRACT:
An apparatus for depositing an electrically conductive layer on the surface of a wafer comprises a flange. The flange has a cylindrical wall and an annulus attached to a first end of the cylindrical wall. The annulus shields the edge region of the wafer surface during electroplating reducing the thickness of the deposited electrically conductive layer on the edge region. Further, the cylindrical wall of the flange can be provided with a plurality of apertures adjacent the wafer allowing gas bubbles entrapped on the wafer surface to readily escape.
REFERENCES:
patent: 3962047 (1976-06-01), Wagner
patent: 4137867 (1979-02-01), Aigo
patent: 4170959 (1979-10-01), Aigo
patent: 4246088 (1981-01-01), Murphy et al.
patent: 4259166 (1981-03-01), Whitehurst
patent: 4280882 (1981-07-01), Hovey
patent: 4304641 (1981-12-01), Grandia et al.
patent: 4339297 (1982-07-01), Aigo
patent: 4339319 (1982-07-01), Aigo
patent: 4341613 (1982-07-01), Prusak et al.
patent: 4466864 (1984-08-01), Bacon et al.
patent: 4469566 (1984-09-01), Wray
patent: 4534832 (1985-08-01), Doiron, Jr.
patent: 4565607 (1986-01-01), Hanak et al.
patent: 4597836 (1986-07-01), Schaer et al.
patent: 4696729 (1987-09-01), Santini
patent: 4828654 (1989-05-01), Reed
patent: 4861452 (1989-08-01), Stierman et al.
patent: 4879007 (1989-11-01), Wong
patent: 4906346 (1990-03-01), Hadersbeck et al.
patent: 4931149 (1990-06-01), Stierman et al.
patent: 5000827 (1991-03-01), Schuster et al.
patent: 5024746 (1991-06-01), Stierman et al.
patent: 5078852 (1992-01-01), Yee et al.
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5135636 (1992-08-01), Yee et al.
patent: 5222310 (1993-06-01), Thompson et al.
patent: 5227041 (1993-07-01), Brogden et al.
patent: 5332487 (1994-07-01), Young, Jr. et al.
patent: 5372699 (1994-12-01), Rischke et al.
patent: 5377708 (1995-01-01), Bergman et al.
patent: 5391285 (1995-02-01), Lytle et al.
patent: 5405518 (1995-04-01), Hsieh et al.
patent: 5421987 (1995-06-01), Tzanavaras et al.
patent: 5429733 (1995-07-01), Ishida
patent: 5437777 (1995-08-01), Kishi
patent: 5441629 (1995-08-01), Kosaki
patent: 5443707 (1995-08-01), Mori
patent: 5447615 (1995-09-01), Ishida
patent: 5462649 (1995-10-01), Keeney et al.
patent: 5472592 (1995-12-01), Lowery
patent: 5498325 (1996-03-01), Nishimura et al.
patent: 5522975 (1996-06-01), Andricacos et al.
patent: 5597460 (1997-01-01), Reynolds
patent: 5620581 (1997-04-01), Ang
patent: 5670034 (1997-09-01), Lowery
patent: 5725745 (1998-03-01), Ikegaya
patent: 5744019 (1998-04-01), Ang
patent: 5750014 (1998-05-01), Stadler et al.
patent: 5776327 (1998-07-01), Botts et al.
patent: 5788829 (1998-08-01), Joshi et al.
patent: 5804052 (1998-09-01), Schneider
patent: 5843296 (1998-12-01), Greenspan
patent: 5855850 (1999-01-01), Sittler
"Upside-Down Resist Coating of Semiconductor Wafers", IBm Technical Disclosure Bulletin, vol. 32, No. 1, Jun. 1989, pp. 311-313.
Evan E. Patton, et al., "Automated Gold Plate-Up Bath Scope Document and Machine Specifications", Tektronix Confidential,dated Aug. 4, 1989, pp. 1-13.
Tektronix Invention Disclosure Form (Company Confidential), not dated, 4 pages.
Contolini Robert J.
Dukovic John Owen
Feng Jingbin
Patton Evan
Reid Jonathan
International Business Machines Inc.
Novellus Systems Inc.
Valentine Donald R.
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