Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2007-09-17
2010-11-16
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S686000, C257SE23145
Reexamination Certificate
active
07834462
ABSTRACT:
According to one embodiment of the present invention, an electric device includes: a top surface and a bottom surface; a contact hole extending from the top surface through the device to the bottom surface; a conductive sealing element which seals the contact hole at or near the bottom surface; a conductive connection which is coupled to the conductive sealing element and which extends through the contact hole to the top surface; and solder material which is provided on a bottom surface of the conductive sealing element.
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Kripesh, V., et al., “Three Dimensional Stacked modules using Silicon carrier,” 2003 IEEE, 2003 Electronics Packaging Technology Conference, pp. 24-29.
Dobritz Stephan
Irsigler Roland
Polaczyk Christoph
Economou John S.
Parekh Nitin
Qimonda AG
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