Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material
Reexamination Certificate
2009-01-09
2010-10-12
Lee, Hsien-ming (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
C438S674000, C438S678000, C205S080000, C205S096000, C205S123000, C257SE21498
Reexamination Certificate
active
07811918
ABSTRACT:
A conformal metallic layer is applied to a selected region of a substrate by forming a pattern of electrically conductive lines on the substrate, placing a bead of a selected metal on the substrate at an edge of the region selected for coating, and passing an electric current through the bead and through conductive lines that extend over the region of the substrate selected for coating with the electric current having a current density sufficient to melt the bead so that metallic material therefrom flows over the conductive lines to form the coating. A pair of electrically conductive connectors is placed in contact with the electrically conductive lines, and an electric power supply is connected to the pair of electrically conductive connectors such that electric current passes through the bead, melts the bead to form a liquid metal, and carries the liquid metal in a continuous stream along the conductive lines, coating the conductive lines conformally in the process.
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Lee Hsien-ming
Lincoln Donald E.
Norris Lisa A.
The United States of America as represented by the Secretary of
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