Electric circuit substrate having a multilayer alignment mark st

Details Electric circuit substrate having a multilayer alignment mark st Electric circuit substrate having a multilayer alignment mark st

1996-06-19

1998-06-16

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361748, 174255, 349152, H05K 114

Patent

active

057681074

ABSTRACT:
An electric circuit substrate having a multilayer structure is constituted from at least three wiring layers including an outermost wiring layer, at least one first inner wiring layer disposed under the outermost wiring layer, and a second inner wiring layer disposed under the at least one first inner wiring layer, each provided with a prescribed conductor pattern, respectively. In the multilayer structure, the outermost wiring layer has an alignment mark, the above-mentioned at least one first inner wiring layer has a blank portion free from its conductor pattern in a position immediately under the alignment mark, and the second inner wiring layer has an entire solid portion of its conductor pattern in a position immediately under the blank portion. The above multilayer structure including the alignment mark is effective in preventing recognition error or recognition failure of the alignment mark, thus allowing accurate positioning of the electric circuit substrate.

REFERENCES:
patent: 4423127 (1983-12-01), Fujimura
patent: 4634227 (1987-01-01), Nishimura et al.
patent: 4710250 (1987-12-01), Kojima
patent: 5418691 (1995-05-01), Tokura
patent: 5468917 (1995-11-01), Brodsky et al.

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