Electric circuit card having a donut shaped land

Details Electric circuit card having a donut shaped land Electric circuit card having a donut shaped land

1995-04-27

1997-09-23

Thomas, Laura

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174264, 361767, H05K 102

Patent

active

056707509

ABSTRACT:
A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.

REFERENCES:
patent: 4328614 (1982-05-01), Schelhorn
patent: 4894271 (1990-01-01), Hani et al.
patent: 5295299 (1994-03-01), Takakashi
patent: 5321211 (1994-06-01), Haslam et al.
patent: 5326936 (1994-07-01), Taniuchi et al.
patent: 5414224 (1995-05-01), Adasko et al.

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