Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent
1990-01-24
1991-07-16
Picard, Leo P.
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
357 70, 357 74, H01L 2302, H01L 2348
Patent
active
050326910
ABSTRACT:
An electric circuit assembly (212) includes a ceramic tub (214) having a substrate floor (216) and an integral side wall (218) around the perimeter thereof and extending upwardly therefrom and having an integral lower wall (270) extending downwardly therefrom. The lower wall (270) is multi-partitioned and includes dividing wall portions (286, 288) providing electrical isolation and preventing sparking or voltage crossover between lead frames (220, 222, 224). The lower multi-partitioned wall also includes an outer peripheral portion (290) generally defining a chamber between the substrate (216) and a lower substrate (226) and enclosing the space between the substrates and encompassing recesses (274, 276, 278) defined in the lower surface of the upper substrate by central inner partitioned wall portions (286, 288, 292, 294). Copper lead frames (220, 222, 224) have pad portions (220a, 222a, 224a), received in respective recesses below respective apertures (240, 242, 244) through the upper substrate (216). A semiconductor chip (238) is connected to the lead frames through the apertures in the substrate.
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"Over 50 years of experience with the Direct Bond Copper process", Tegmen Corp., 1201 East Fayette Street, Syracuse, New York 13210.
Ledynh Bot L.
Picard Leo P.
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