Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1992-03-19
1993-04-06
Paumen, Gary F.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 66, H01R 903
Patent
active
051998823
ABSTRACT:
Component package (10) includes component (24) having conductive pads (26) attached to the lid (20) of a housing (30) containing wires (14) of a cable (12) positioned therewithin to be engaged by an elastomeric connector (42) having a resilient core (44) with a thin, dielectric film (46) carrying conductive traces (48) extending over a tab (50) with the housing and lid driving the pads against the connector to interconnect the pads to the traces to the wires upon closure. In one embodiment, the wires (14) are solder coated (16) with a solder reflow effecting a tab to wire connection and in another embodiment, precious metal coatings are employed to allow pressure connection between wire and traces. Alternatively, coatings of conductive inks or conductive adhesives may be used. The conductive traces may be placed on centers appropriate to the particular centers in the array of conductive pads and in the array of wires, such centers being selectively varied.
REFERENCES:
patent: 4057311 (1977-11-01), Evans
patent: 4740165 (1988-04-01), Tomino et al.
Bates Warren A.
Deak Frederick R.
Johnson David C.
Volz Keith L.
AMP Incorporated
Paumen Gary F.
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