Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1989-10-27
1991-03-12
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439591, H01R 909
Patent
active
049988859
ABSTRACT:
This invention provides an interposer for electrically connecting two substrates with high density interconnections. The interposer comprises an elastomeric material surrounding fine metal wires which extend through the elastomeric material. The elastomeric material provides mechanical support and electrical isolation for the wires which connect the two opposing surfaces of the interposer with mating substrates. One surface of the interposed has scribes cut into it which mechanically isolate the individual wires. This mechanical isolation between wires reduces the stress placed on the substrates from being connected when the interposer is compressed between the substrates. The support given individual wires by the elastomeric material is controlled, by adjusting the spacing and widths of the scribes, to provide uniform compression across the substrates. Reducing the differentials in compression across the substrates reduces the stress on the substrates and their connections, and therefore, maintains substrate reliability when the substrates are exposed to extended time periods under compression.
REFERENCES:
patent: 3795037 (1974-03-01), Luttmer
patent: 4118092 (1978-10-01), Sado et al.
patent: 4203203 (1980-05-01), Gilissen et al.
patent: 4295700 (1981-10-01), Sado
patent: 4400234 (1983-08-01), Berg
patent: 4408814 (1983-10-01), Takashi et al.
patent: 4509099 (1985-04-01), Takamatsu et al.
patent: 4520562 (1985-06-01), Sado et al.
patent: 4793814 (1988-12-01), Zifcak
Abrams Neil
Clark George E.
Harper Blaney
International Business Machines - Corporation
Klitzman Maurice H.
LandOfFree
Elastomeric area array interposer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Elastomeric area array interposer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Elastomeric area array interposer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-445395