Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-07-26
2005-07-26
Berman, Susan (Department: 1711)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S275700, C156S272200, C428S421000, C428S423100, C428S480000, C428S500000, C428S521000, C428S522000, C428S523000, C522S031000, C522S066000, C522S120000, C522S121000, C522S122000, C522S111000, C522S141000, C522S142000, C522S143000, C525S055000, C525S088000, C526S332000, C526S333000, C526S334000
Reexamination Certificate
active
06921454
ABSTRACT:
A radiation curable adhesive composition which includes:a) an α,β-olefinically unsaturated ether monomer component consisting of one or more compounds having the formula:in-line-formulae description="In-line Formulae" end="lead"?R[O—CH═CHR1]n (I)in-line-formulae description="In-line Formulae" end="tail"?where R is an n-valent carbon-linked organic group R1is H or a monovalent carbon-linked organic group and n has a value of 1 or more,b) an elastomeric polymer having a tensile strength at break of greater than 1500 psi (10342 kPa), and an elongation at break of greater than 100%, andc) a cationic photoinitiator.
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Decker, Christian, “High-Speed Curing by Laser Irradiation”, Nucl. Instr. and Meth. in Phys. Res. B 151 (1999), pp. 22-28.
Attarwala Shabbir
DeMarco JoAnn
Shi Weitong
Bauman Steven C.
Berman Susan
Henkel Corporation
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