Elastomer-modified chemical mechanical polishing pad

Details Elastomer-modified chemical mechanical polishing pad Elastomer-modified chemical mechanical polishing pad

2008-05-13

2008-05-13

Morgan, Eileen P. (Department: 3723)

Abrading

Flexible-member tool, per se

C051S307000

Reexamination Certificate

active

07371160

ABSTRACT:
The chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad includes a polymeric matrix with an elastomeric polymer distributed within the polymeric matrix. The polymeric matrix has a glass transition above room temperature; and the elastomeric polymer has an average length of at least 0.1 μm in at least one direction, represents 1 to 45 volume percent of polishing pad and has a glass transition temperature below room temperature. The polishing pad has an increased diamond conditioner cut rate in comparison to a polishing pad formed from the polymeric matrix without the elastomeric polymer.

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