Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-01-11
2005-01-11
Niebling, John F. (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257SE23001, C439S066000, C439S071000, C439S091000, C439S591000, C361S719000, C361S831000
Reexamination Certificate
active
06841882
ABSTRACT:
An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.
REFERENCES:
patent: 4003621 (1977-01-01), Lamp
patent: 4249302 (1981-02-01), Crepeau
patent: 4932883 (1990-06-01), Hsia et al.
patent: 5071359 (1991-12-01), Arnio et al.
patent: 5245751 (1993-09-01), Locke et al.
patent: 5427535 (1995-06-01), Sinclair
patent: 5828226 (1998-10-01), Higgins et al.
patent: 6264476 (2001-07-01), Li et al.
patent: 6663399 (2003-12-01), Ali et al.
patent: 6712620 (2004-03-01), Li et al.
patent: 6722893 (2004-04-01), Li et al.
Birch & Stewart Kolasch & Birch, LLP
Niebling John F.
Pompey Ron
VIA Technologies Inc.
LandOfFree
Elastomer interposer for grid array packages and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Elastomer interposer for grid array packages and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Elastomer interposer for grid array packages and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3379312