Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-03-27
2007-03-27
Dinh, Tuan (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S777000, C361S807000, C361S810000, C439S066000, C439S073000
Reexamination Certificate
active
10775590
ABSTRACT:
An elasto-plastic socket for Land or Ball Grid Array package comprising a plurality of metal contacts embedded in a substrate by lamination. The curved plate spring of the metal contacts enable large deformation to accommodate all tolerances other than package tolerance and ensure uniform contact pressure across the package because they are designed based on the application of elasto-plasticity theory. An elasto-plastic stiffener shares the pressure from heat sink to package substrate and semiconductor. A cutting edge subsystem assembly for Land or Ball Grid Array package integrates L/BGA socket, L/BGA package and heat sink with a frame on top of PCB to increase the stiffness. The methods of post manufacturing including post forming and post age hardening used for testing socket application can increase the durability.
REFERENCES:
patent: 4161346 (1979-07-01), Cherian et al.
patent: 5380210 (1995-01-01), Grabbe et al.
patent: 5919050 (1999-07-01), Kehley et al.
patent: 5984693 (1999-11-01), McHugh et al.
patent: 6149443 (2000-11-01), Moran
patent: 6171128 (2001-01-01), Huang et al.
patent: 6183269 (2001-02-01), Sarkissian et al.
patent: 6449155 (2002-09-01), Colbert et al.
patent: 6475011 (2002-11-01), Sinha et al.
patent: 6485320 (2002-11-01), Ma
patent: 6545879 (2003-04-01), Goodwin
patent: 6626683 (2003-09-01), Lai
patent: 6672881 (2004-01-01), Evans
patent: 6765793 (2004-07-01), Kehret et al.
patent: 6930884 (2005-08-01), Cromwell et al.
patent: 6974331 (2005-12-01), Brown et al.
patent: 6976888 (2005-12-01), Shirai et al.
Bui Hung S.
Dinh Tuan
Hsia David C.
Patent Law Group LLP
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