Elastic wave device and manufacturing method of the same

Details Elastic wave device and manufacturing method of the same Elastic wave device and manufacturing method of the same

2007-04-05

2009-10-13

Takaoka, Dean O (Department: 2817)

Wave transmission lines and networks

Plural channel systems

Having branched circuits

C333S193000

Reexamination Certificate

active

07602262

ABSTRACT:
An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.

REFERENCES:
patent: 6075307 (2000-06-01), Fukiharu
patent: 6121161 (2000-09-01), Rossman et al.
patent: 6784765 (2004-08-01), Yamada et al.
patent: 6984421 (2006-01-01), Pahl et al.
patent: 6985048 (2006-01-01), Takamine et al.
patent: 7301421 (2007-11-01), Yokota et al.
patent: 01/59827 (2001-08-01), None

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