Elastic conductive resin, and electronic device including...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C174S260000

Reexamination Certificate

active

07875807

ABSTRACT:
An electronic device includes an electronic part including at least one first electrode, a substrate including at least one second electrode, and at least one bump formed on the at least one first electrode and formed from an elastic conductive resin including a resin having rubbery elasticity, and an acicular conductive filler including a surface layer coated with one of gold, silver, nickel, and copper. The at least one first electrode and the at least one second electrode are electrically connected to each other by mechanically contacting the at least one bump with the at least one second electrode.

REFERENCES:
patent: 4568592 (1986-02-01), Kawaguchi et al.
patent: 4701279 (1987-10-01), Kawaguchi et al.
patent: 4740657 (1988-04-01), Tsukagoshi et al.
patent: 5604026 (1997-02-01), King
patent: 5624268 (1997-04-01), Maeda et al.
patent: 5686703 (1997-11-01), Yamaguchi
patent: 5738936 (1998-04-01), Hanrahan
patent: 6020059 (2000-02-01), Yamada et al.
patent: 6156427 (2000-12-01), Gotoh et al.
patent: 6243147 (2001-06-01), Sano
patent: 6281450 (2001-08-01), Urasaki et al.
patent: 6384128 (2002-05-01), Wadahara et al.
patent: 6472247 (2002-10-01), Andoh et al.
patent: 6533963 (2003-03-01), Schleifstein et al.
patent: 6884833 (2005-04-01), Chheang et al.
patent: 6900550 (2005-05-01), Yamazaki et al.
patent: 6936783 (2005-08-01), Kawaguchi et al.
patent: 6956072 (2005-10-01), Kanaka et al.
patent: 2004/0074671 (2004-04-01), Hirano et al.
patent: 2004/0108133 (2004-06-01), Sano et al.
patent: 64-23600 (1989-01-01), None
patent: 1-148515 (1989-06-01), None
patent: 2-60945 (1990-03-01), None
patent: 2-103944 (1990-04-01), None
patent: 4-6841 (1992-01-01), None
patent: 10-242616 (1998-09-01), None
patent: 10-256304 (1998-09-01), None
patent: 2002-541616 (2002-12-01), None
patent: 2004-05175 (2004-02-01), None
patent: 2004-165066 (2004-06-01), None
patent: WO 00/47660 (2000-08-01), None
Machine translation of JP2004-051755 (Feb. 2004).
Machine translation of JP2004-165066 (Jun. 2004).
Fukuda Metal Foil & Powder Co., Ltd., No. 6116, pp. 2-8, “Metal Powder” Complete Catalog of Metal Powders.
Huawu Wu, et al., Studies on high molecule electrically conductive film containing tetrapod-like ZnO whiskers, 1999,304(4), 1995-2006 Tsinghua Tongfang Optical Disc Co., Ltd., pp. 398-390 (with English translation).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Elastic conductive resin, and electronic device including... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Elastic conductive resin, and electronic device including..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Elastic conductive resin, and electronic device including... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2699352

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.